May 2019, Volume 6 Issue 1


Technological advancement in materials design, modeling and manufacturing processes enable new frontiers of research in the field of Civil Engineering. Considering the interdependence of how the design evolves, affecting construction and sustainability efforts, the main theme of the ISEC-10 conference is "Interdependence of Structural Engineering and Construction Management."

This conference is organized by the University of Illinois at Chicago and Illinois Institute of Technology. The proceedings of ISEC-10 include manuscripts that represent cutting-edge research studies including green infrastructure, alternative concrete materials with unique properties, innovative housing and project management practices, methods to increase the durability of structural systems, rehabilitation and retrofitting methods, new technologies in construction management, and next generation manufacturing systems for construction. The studies include various materials and systems used in infrastructure: concrete, steel, composites, wood, and masonry. Considering the fact that Infrastructure in the world is invariably in poor health, the conference is expected to have a significant impact on the innovative solutions to address challenges of the domestic and global aging infrastructure as well as futuristic smart and resilient designs.

ISEC-10 provides a unique platform to scholars, researchers and practitioners across all continents and countries to present and disseminate the latest innovative ideas, research results, and findings during the conference as well as within the conference proceedings. The conference proceedings have two hundred six (206) manuscripts from forty (40) countries. The technical content of each manuscript is carefully reviewed by the editorial team, the external reviewers, and copy and format editors. The proceedings present research papers as well as representative studies from practitioners.

On behalf of the organizing committee, we wish to thank all authors who contributed to the proceedings and the conference, and the external reviewers who diligently reviewed and submitted their reviews in a timely manner. We thank the University of Illinois at Chicago for providing the facilities and infrastructure to host the technical sessions, and Illinois Institute of Technology for providing technical and logistic support.

Didem Ozevin, University of Illinois at Chicago, USA
Hossein Ataei, University of Illinois at Chicago, USA
Mehdi Modares, Illinois Institute of Technology, USA
Asli Pelin Gurgun, Yildiz Technical University, Turkey
Siamak Yazdani, Heyer Engineering, USA
Amarjit Singh, University of Hawaii at Manoa, USA